Leadframes are an indispensable component of semi-conductor packaging. The role of a leadframe is to connect IC chip to substrate mechanically.
Mitsui High-tec, Inc. made it possible to produce the leadframe by use of a die and realized the mass production of leadframes by stamping for the first time in the world.
Performance required for leadframes is various, and it was very difficult to satisfy such requirements. However, by integrating the technologies, we succeeded in satisfying them and, even at present, we are positively tackling the development of new products.
We always pursue an ideal state and try to realize it. We find a breakthrough by examining the problem from various aspects.
Some dies have a tips thinner than a human hair. In order to punch a leadframe by such a thin tip, it is necessary to secure an accurate clearance and manufacture a precision die that can realize such stamping technology. In addition, punches are available on request.