A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages.
Mitsui High-tec accomplished the production of IC leadframes by precision-die-stamping for the first time in the world and, at present, we are producing leadframes not only by stamping but also by chemical etching.